Japan–U.S. semiconductor forum targets materials, equipment and packaging ties
Important news | About 250 industry, government and research participants discussed practical Japan–U.S. semiconductor collaboration.
Editorial desk
Important news: JETRO reported on 23 October 2026 that the Japan–U.S. Semiconductor Collaboration Forum had been held during SEMICON West in San Francisco on 13 October. JETRO San Francisco and California GO-Biz co-hosted the event, attended by about 250 people from semiconductor companies, startups, government, research bodies and business groups. It was an industry forum, not a funding or procurement award.
The forum examined concrete areas where the two ecosystems can complement each other. California presented its strengths in semiconductor businesses, universities, research, startups and venture capital, and discussed linking design and AI capabilities with Japan’s materials, manufacturing equipment and precision technologies. Smaller suppliers may therefore find entry points in materials, packaging, testing, measurement and integration—not only chips.
JETRO highlighted an operating collaboration node: Resonac’s US-JOINT advanced-packaging R&D facility in Union City, California, began full-scale operations in April 2026. It brings together 12 Japanese and U.S. companies to develop and test packaging technologies with customers. Early technical discussion, shared goals and hands-on tests were presented as important, but the report did not announce new orders for participants.
A second example involved California startup Diamond Quanta and Japan-based ExtenD. They signed an agreement in October 2025 to develop diamond optical products, with Heller Industries supporting equipment integration. Diamond Quanta also announced a Petaluma operations and process-development centre in October 2026 for customer testing and pilot-manufacturing preparation. Preparation is not the same as confirmed volume production or procurement.
Six companies also presented materials, components and tools: advanced-packaging materials, ceramic components and substrates, analog computing intended to reduce AI-training energy, high-resolution thermal measurement, and composite-material recycling. Participants later discussed possible research, technology and business partnerships. The official report confirms presentations and discussions, not signed deals, investments or purchases.
Editorial next step: prepare a one-page technical collaboration card stating the process problem, technology readiness, sample or test available, equipment interface, IP arrangement and desired collaboration point. Map it against design, materials, equipment, advanced packaging, testing and measurement. This is business-development guidance, not event eligibility; use formal technical documents to propose a small validation project.
Sources
Some images in this article are generated illustrations.